Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596621 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Bruce Anthony Copeland, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr., Jun Wang | 2003-07-22 |