JW

Jun Wang

IBM: 2 patents #1,011 of 5,539Top 20%
📍 Shanghai, NY: #3 of 10 inventorsTop 30%
Overall (2003): #58,694 of 273,478Top 25%
2
Patents 2003

Issued Patents 2003

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6596621 Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate Bruce Anthony Copeland, Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr., Lovell B. Wiggins 2003-07-22
6555912 Corrosion-resistant electrode structure for integrated circuit decoupling capacitors Bruce Anthony Copeland, Rebecca Y. Gorrell, Donald W. Scheider, Mark A. Takacs, Kenneth J. Travis, Jr. +1 more 2003-04-29