Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6596621 | Method of forming a lead-free tin-silver-copper based solder alloy on an electronic substrate | Rebecca Y. Gorrell, Mark A. Takacs, Kenneth J. Travis, Jr., Jun Wang, Lovell B. Wiggins | 2003-07-22 |
| 6555912 | Corrosion-resistant electrode structure for integrated circuit decoupling capacitors | Rebecca Y. Gorrell, Donald W. Scheider, Mark A. Takacs, Kenneth J. Travis, Jr., Peter O. Ulanmo +1 more | 2003-04-29 |