TO

Tomoyuki Ohmura

HI Hitachi: 1 patents #1,745 of 4,225Top 45%
Overall (2003): #100,289 of 273,478Top 40%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6585149 Packaging method using lead-free solder Tetsuya Nakatsuka, Masahide Okamoto 2003-07-01