Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6585149 | Packaging method using lead-free solder | Masahide Okamoto, Tomoyuki Ohmura | 2003-07-01 |
| 6563225 | Product using Zn-Al alloy solder | Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Masahide Okamoto | 2003-05-13 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Hanae Shimokawa, Masato Nakamura, Yuji Fujita, Toshiharu Ishida +4 more | 2003-04-29 |