Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6658733 | Method of manufacturing via interconnection of glass-ceramic wiring board | Norihiro Ami, Shosaku Ishihara, Minoru Tanaka, Mutsumi Horikoshi, Akihiro Yasuda | 2003-12-09 |
| 6585149 | Packaging method using lead-free solder | Tetsuya Nakatsuka, Tomoyuki Ohmura | 2003-07-01 |
| 6563225 | Product using Zn-Al alloy solder | Tasao Soga, Toshiharu Ishida, Kazuma Miura, Hanae Hata, Tetsuya Nakatsuka | 2003-05-13 |
| 6555052 | Electron device and semiconductor device | Tasao Soga, Hanae Shimokawa, Tetsuya Nakatsuka, Masato Nakamura, Yuji Fujita +4 more | 2003-04-29 |