Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6503803 | Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer | Hiromi Todorobaru, Hideo Miura, Masayuki Suzuki, Shinji Nishihara, Shuji Ikeda +5 more | 2003-01-07 |