Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656828 | Method of forming bump electrodes | Touta Maitani | 2003-12-02 |
| 6617691 | Semiconductor device | Takashi Nakajima, Tomio Iwasaki, Hiroyuki Ohta, Hideo Miura, Masashi Sahara +2 more | 2003-09-09 |
| 6583049 | Semiconductor integrated circuit device and method for making the same | Masayuki Suzuki, Masashi Sahara, Shinichi Ishida, Hiromi Abe, Sonoko Tohda +3 more | 2003-06-24 |
| 6548904 | Semiconductor device having a capacitor and a metal interconnect layer with tungsten as a main constituent material and containing molybdenum | Tomio Iwasaki, Hideo Miura, Takashi Nakajima, Hiroyuki Ohta, Masashi Sahara | 2003-04-15 |
| 6545362 | Semiconductor device and method of manufacturing the same | Hiroshi Moriya, Tomio Iwasaki, Hideo Miura, Masashi Sahara | 2003-04-08 |
| 6538329 | Semiconductor integrated circuit device and method for making the same | Masayuki Suzuki, Masashi Sahara, Shinichi Ishida, Hiromi Abe, Sonoko Tohda +3 more | 2003-03-25 |
| 6503803 | Method of fabricating a semiconductor integrated circuit device for connecting semiconductor region and electrical wiring metal via titanium silicide layer | Hiromi Todorobaru, Hideo Miura, Masayuki Suzuki, Shuji Ikeda, Masashi Sahara +5 more | 2003-01-07 |