Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Kazuhito Kobayashi, Yasuyuki Mizuno, Daisuke Fujimoto | 2003-12-23 |
| 6572968 | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards | Shigeo Sase, Tomio Fukuda, Michitoshi Arata | 2003-06-03 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Michitoshi Arata, Kazuhito Kobayashi | 2003-05-06 |
| 6524717 | Prepreg, metal-clad laminate, and printed circuit board obtained from these | Tomio Fukuda, Masato Miyatake, Masahisa Ose | 2003-02-25 |