Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6572968 | Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards | Nozomu Takano, Shigeo Sase, Tomio Fukuda | 2003-06-03 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Nozomu Takano, Kazuhito Kobayashi | 2003-05-06 |