Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667107 | Thermosetting resin composition and use thereof | Shinji Tsuchikawa, Yasuyuki Mizuno, Daisuke Fujimoto, Nozomu Takano | 2003-12-23 |
| 6616871 | Filling step control method of injection molding machine | Yukio Iimura, Makoto Nishizawa, Haruyuki Matsubayashi, Nobuyuki Asanuma, Yutaka Yamaguchi +2 more | 2003-09-09 |
| 6558797 | Adhesive-coated copper foil, and copper-clad laminate and printed circuit board both obtained with the same | Michitoshi Arata, Nozomu Takano | 2003-05-06 |