Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645847 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Boris Relja, Randhir Bubber, Lino Velo +3 more | 2003-11-11 |
| 6627995 | Microelectronic interconnect material with adhesion promotion layer and fabrication method | Ajit Paranjpe, Mehrdad M. Moslehi, Boris Relja, Randhir Bubber, Lino Velo +3 more | 2003-09-30 |
| 6565717 | Apparatus for sputtering ionized material in a medium to high density plasma | John C. Forster | 2003-05-20 |