Issued Patents 2003
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656271 | Method of manufacturing semiconductor wafer method of using and utilizing the same | Takao Yonehara, Kunio Watanabe, Tetsuya Shimada, Kiyofumi Sakaguchi | 2003-12-02 |
| 6653206 | Method and apparatus for processing composite member | Kazutaka Yanagita, Kiyofumi Sakaguchi, Hirokazu Kurisu | 2003-11-25 |
| 6653205 | Composite member separating method, thin film manufacturing method, and composite member separating apparatus | Kazutaka Yanagita, Kiyofumi Sakaguchi | 2003-11-25 |
| 6629539 | Sample processing system | Kazutaka Yanagita, Kiyofumi Sakaguchi | 2003-10-07 |
| 6624047 | Substrate and method of manufacturing the same | Kiyofumi Sakaguchi, Kazutaka Yanagita | 2003-09-23 |
| 6609446 | Separating apparatus, separating method, and method of manufacturing semiconductor substrate | Takao Yonehara, Kiyofumi Sakaguchi, Kazutaka Yanagita, Hirokazu Kurisu | 2003-08-26 |
| 6605518 | Method of separating composite member and process for producing thin film | Katsumi Nakagawa, Nobuhiko Sato, Kiyofumi Sakaguchi, Kazutaka Yanagita, Takao Yonehara | 2003-08-12 |
| 6597039 | Composite member, its separation method, and preparation method of semiconductor substrate by utilization thereof | Kiyofumi Sakaguchi, Kazutaka Yanagita | 2003-07-22 |
| 6527031 | Sample separating apparatus and method, and substrate manufacturing method | Kazutaka Yanagita, Kiyofumi Sakaguchi | 2003-03-04 |