Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6593699 | Method for molding a polymer surface that reduces particle generation and surface adhesion forces while maintaining a high heat transfer coefficient | — | 2003-07-15 |
| 6583428 | Apparatus for the backside gas cooling of a wafer in a batch ion implantation system | David J. Chipman, Robert J. Mitchell, Gary J. Rosen, Dale K. Stone | 2003-06-24 |
| 6552892 | Method and apparatus for the grounding of process wafers by the use of conductive regions created by ion implantation into the surface of an electrostatic clamp | James C. Carroll, Dennis Klesel, Klaus Petry | 2003-04-22 |