Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645860 | Adhesion promotion method for CVD copper metallization in IC applications | Lawrence J. Charneski, Tue Nguyen | 2003-11-11 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645860 | Adhesion promotion method for CVD copper metallization in IC applications | Lawrence J. Charneski, Tue Nguyen | 2003-11-11 |