Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664128 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +4 more | 2003-12-16 |
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more | 2003-09-09 |
| 6610924 | Semiconductor package | Shih-Chang Lee | 2003-08-26 |
| 6573123 | Semiconductor chip package and manufacturing method thereof | Sai LI, Chun-Hung Lin, Shin-Hua Chao | 2003-06-03 |
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Chun-Hung Lin, I Lee, Kun-Ching Chen | 2003-03-18 |
| 6528393 | Method of making a semiconductor package by dicing a wafer from the backside surface thereof | — | 2003-03-04 |