Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6664128 | Bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Jau-Shoung Chen, Ching-Huei Su +4 more | 2003-12-16 |
| 6617237 | Lead-free bump fabrication process | Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Jau-Shoung Chen, Ching-Huei Su +5 more | 2003-09-09 |
| 6564449 | Method of making wire connection in semiconductor device | Yu-Fang Tsai, Jian Chen | 2003-05-20 |