Issued Patents 2003
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642612 | Lead-bond type chip package and manufacturing method thereof | Yung-I Yeh | 2003-11-04 |
| 6551855 | Substrate strip and manufacturing method thereof | Yi Ding, Yung-I Yeh | 2003-04-22 |
| 6534852 | Ball grid array semiconductor package with improved strength and electric performance and method for making the same | Chun-Hung Lin, I Lee, Su Tao | 2003-03-18 |
| 6528882 | Thermal enhanced ball grid array package | Yi Ding, Chang-Chi Lee, Yung-I Yeh | 2003-03-04 |