Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642612 | Lead-bond type chip package and manufacturing method thereof | Kun-Ching Chen | 2003-11-04 |
| 6551855 | Substrate strip and manufacturing method thereof | Yi Ding, Kun-Ching Chen | 2003-04-22 |
| 6528882 | Thermal enhanced ball grid array package | Yi Ding, Chang-Chi Lee, Kun-Ching Chen | 2003-03-04 |