Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498074 | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | Oleg Siniaguine, Sergey Savastiouk | 2002-12-24 |
| 6498381 | Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same | Oleg Siniaguine | 2002-12-24 |
| 6448153 | Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners | Oleg Siniaguine, Sergey Savastiouk | 2002-09-10 |