Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan +1 more | 2002-07-30 |
SL
Shih-Jang Lin
Overall (2002): #118,136 of 266,432Top 45%
1
Patents 2002