Issued Patents 2002
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6489684 | Reduction of electromigration in dual damascene connector | Tsu Shi, Ming-Hsing Tsai | 2002-12-03 |
| 6466427 | Microelectronic capacitor structure compatible with copper containing microelectronic conductor layer processing | — | 2002-10-15 |
| 6420258 | Selective growth of copper for advanced metallization | Ming-Hsing Tsai | 2002-07-16 |
| 6399486 | Method of improved copper gap fill | Ming-Hsing Tsai | 2002-06-04 |
| 6384442 | Fabrication process for metal-insulator-metal capacitor with low gate resistance | — | 2002-05-07 |
| 6350667 | Method of improving pad metal adhesion | Fan Yang | 2002-02-26 |