Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6423640 | Headless CMP process for oxide planarization | Tze-Liang Lee, Chen-Hwa Yu | 2002-07-23 |
| 6350667 | Method of improving pad metal adhesion | Sheng-Hsiung Chen | 2002-02-26 |
| 6340638 | Method for forming a passivation layer on copper conductive elements | Jong Chen, Tze-Liang Lee | 2002-01-22 |