Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chen-Wen Tsai, Wei-Feng Lin | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Wei-Feng Lin | 2002-04-02 |