Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498505 | Jigs for semiconductor components | Mu-Sheng Liao, Wei-Feng Lin, Ching-Jung Huang | 2002-12-24 |
| 6423577 | Method for reducing an electrical noise inside a ball grid array package | Cheng Cheng, Chia-Wen Shih | 2002-07-23 |
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chung-Ju Wu, Wei-Feng Lin | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chung-Ju Wu, Wei-Feng Lin | 2002-04-02 |