Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6498505 | Jigs for semiconductor components | Mu-Sheng Liao, Chen-Wen Tsai, Ching-Jung Huang | 2002-12-24 |
| 6395996 | Multi-layered substrate with a built-in capacitor design | Chen-Wen Tsai, Chung-Ju Wu | 2002-05-28 |
| 6365970 | Bond pad structure and its method of fabricating | Chen-Wen Tsai, Chung-Ju Wu | 2002-04-02 |