Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6500564 | Semiconductor encapsulating epoxy resin composition and semiconductor device | Kazuhiro Arai, Hidenori Mizushima, Shigeki Ino, Yasuo Kimura, Takayuki Aoki | 2002-12-31 |
| 6479167 | Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith | Kazuaki Sumita | 2002-11-12 |
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2002-08-06 |
| 6399677 | Epoxy resin compositions and premolded semiconductor packages | Kazutoshi Tomiyoshi, Kazuhiro Arai | 2002-06-04 |
| 6383659 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Miyuki Wakao | 2002-05-07 |
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Miyuki Wakao | 2002-04-23 |
| 6376100 | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device | Kazuaki Sumita | 2002-04-23 |
| 6372839 | Flip-chip type semiconductor device underfill | Kunio Ito, Kazuaki Sumita | 2002-04-16 |
| 6342309 | Epoxy resin composition and semiconductor device | Shigeki Ino, Yasuo Kimura, Takayuki Aoki, Kazuhiro Arai, Hidenori Mizushima | 2002-01-29 |