Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2002-08-06 |
| 6383659 | Epoxy resin composition, laminate film using the same, and semiconductor device | Tsuyoshi Honda, Toshio Shiobara | 2002-05-07 |
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kazuaki Sumita, Kimitaka Kumagae, Toshio Shiobara | 2002-04-23 |