Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479167 | Sealing material for flip-chip semiconductor device, and flip-chip semiconductor device made therewith | Toshio Shiobara | 2002-11-12 |
| 6429238 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2002-08-06 |
| 6376100 | Flip-chip type semiconductor device underfill material and flip-chip type semiconductor device | Toshio Shiobara | 2002-04-23 |
| 6376923 | Flip-chip type semiconductor device sealing material and flip-chip type semiconductor device | Kimitaka Kumagae, Miyuki Wakao, Toshio Shiobara | 2002-04-23 |
| 6372839 | Flip-chip type semiconductor device underfill | Kunio Ito, Toshio Shiobara | 2002-04-16 |