Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6355562 | Adhesion promotion method for CVD copper metallization in IC applications | Tue Nguyen, Gautam Bhandari | 2002-03-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6355562 | Adhesion promotion method for CVD copper metallization in IC applications | Tue Nguyen, Gautam Bhandari | 2002-03-12 |