Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6379748 | Tantalum amide precursors for deposition of tantalum nitride on a substrate | Thomas H. Baum | 2002-04-30 |
| 6355562 | Adhesion promotion method for CVD copper metallization in IC applications | Lawrence J. Charneski, Tue Nguyen | 2002-03-12 |