Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6479893 | Ball-less clip bonding | Chee Chew Hiong | 2002-11-12 |
| 6475834 | Method of manufacturing a semiconductor component and semiconductor component thereof | Dave Culbertson, Chee Hiong CHEW | 2002-11-05 |
| 6436736 | Method for manufacturing a semiconductor package on a leadframe | Hou Boon Tan, Kuan Ming Kan | 2002-08-20 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Kenneth Teik Kheong Low, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |