Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6475834 | Method of manufacturing a semiconductor component and semiconductor component thereof | Saat Shukri Embong, Dave Culbertson | 2002-11-05 |
| 6472731 | Solder clad lead frame for assembly of semiconductor devices and method | — | 2002-10-29 |
| 6392288 | Lead frame for assembly for thin small outline plastic encapsulated packages | Aik Chong Tan, Shan Chong Tan | 2002-05-21 |
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Kenneth Teik Kheong Low, Saat Shukri Embong, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |