Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6376266 | Semiconductor package and method for forming same | James P. Letterman, Jr., Saat Shukri Embong, Chee Hiong CHEW, Boon Huat Lim, Aik Chong Tan +4 more | 2002-04-23 |