Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485815 | Multi-layered dielectric layer including insulating layer having Si-CH3 bond therein and method for fabricating the same | Hyun Dam Jeong, Hee-Sook Park, Hong-Jae Shin | 2002-11-26 |
| 6355554 | Methods of forming filled interconnections in microelectronic devices | Gil-Heyun Choi, Eung-Joon Lee | 2002-03-12 |