Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6485815 | Multi-layered dielectric layer including insulating layer having Si-CH3 bond therein and method for fabricating the same | Hyun Dam Jeong, Hee-Sook Park, Byeong-Jun Kim | 2002-11-26 |
| 6483162 | Semiconductor device having improved metal line structure and manufacturing method therefor | Dong-chul Kwon, Young-Jin Wee, Sung Jin Kim | 2002-11-19 |
| 6432843 | Methods of manufacturing integrated circuit devices in which a spin on glass insulation layer is dissolved so as to recess the spin on glass insulation layer from the upper surface of a pattern | Jae Hak Kim | 2002-08-13 |
| 6368906 | Method of planarization using selecting curing of SOG layer | Ju-Seon Goo | 2002-04-09 |