Issued Patents 2002
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6471115 | Process for manufacturing electronic circuit devices | Masahito Ijuin, Toru Nishikawa, Ryohei Sato, Mitsugu Shirai, Yuzo Taniguchi +2 more | 2002-10-29 |
| 6460755 | Bump forming method and apparatus therefor | Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda +8 more | 2002-10-08 |
| 6413850 | Method of forming bumps | Noriyuki Ooroku, Takamichi Suzuki, Asao Nishimura | 2002-07-02 |
| 6402014 | Method of forming bumps | Asao Nishimura, Takamichi Suzuki, Teru Fujii, Masayuki Morishima, Yasuyuki Nakajima +1 more | 2002-06-11 |
| 6400020 | Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers | Tatsuya Yoneda, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki | 2002-06-04 |