Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6460755 | Bump forming method and apparatus therefor | Kosuke Inoue, Takamichi Suzuki, Katsuhiro Iwashita, Tatsuya Yoneda, Michiharu Honda +8 more | 2002-10-08 |
| 6406357 | Grinding method, semiconductor device and method of manufacturing semiconductor device | Shinichi Kazui, Kazuo Shirase, Kenji Morita, Hideaki Sasaki | 2002-06-18 |