Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6460755 | Bump forming method and apparatus therefor | Kosuke Inoue, Takamichi Suzuki, Hitoshi Odashima, Katsuhiro Iwashita, Michiharu Honda +8 more | 2002-10-08 |
| 6400020 | Aggregate of semiconductor devices including semiconductor packages arranged on a first tape and wound on a reel and also including a spacer tape provided with spacers | Kosuke Inoue, Takamichi Suzuki, Ryosuke Kimoto, Junichi Suzuki | 2002-06-04 |