Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6458690 | Method for manufacturing a multilayer interconnection structure | Toshiyuki Takewaki, Yoshihisa Matsubara | 2002-10-01 |
| 6379782 | Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same | Yoshihisa Matsubara, Toshiyuki Takewaki | 2002-04-30 |
| 6376363 | Forming method of copper interconnection and semiconductor wafer with copper interconnection formed thereon | — | 2002-04-23 |