Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6417576 | Method and apparatus for attaching multiple metal components to integrated circuit modules | Ron Ellenberger, Ronald James Schoonejongen | 2002-07-09 |
| 6356453 | Electronic package having flip chip integrated circuit and passive chip component | Christopher M. Scanlan, Pat O'Brien | 2002-03-12 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Anthony James LoBianco, Stephen G. Shermer, Vincent DiCaprio, Thomas P. Glenn | 2002-01-22 |
| 6337228 | Low-cost printed circuit board with integral heat sink for semiconductor package | John R. McMillan, Ronald Patrick Huemoeller | 2002-01-08 |