Issued Patents 2002
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6501184 | Semiconductor package and method for manufacturing the same | WonSun Shin, DoSung Chun, SeonGoo Lee, Sangho Lee | 2002-12-31 |
| 6489667 | Semiconductor device and method of manufacturing such device | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Paul R. Hoffman | 2002-12-03 |
| 6472758 | Semiconductor package including stacked semiconductor dies and bond wires | Thomas P. Glenn, Lee Smith, David Zoba, Kambhampati Ramakrishna | 2002-10-29 |
| 6462274 | Chip-scale semiconductor package of the fan-out type and method of manufacturing such packages | Il Kwon Shim, Chang Kyu Park, Byung Joon Han, Paul R. Hoffman | 2002-10-08 |
| 6452278 | Low profile package for plural semiconductor dies | Sean T. Crowley, J. Mark Bird | 2002-09-17 |
| 6414396 | Package for stacked integrated circuits | Il Kwon Shim, Paul R. Hoffman, Byung Joon Han | 2002-07-02 |
| 6406934 | Wafer level production of chip size semiconductor packages | Thomas P. Glenn, Steven Webster | 2002-06-18 |
| 6395578 | Semiconductor package and method for fabricating the same | WonSun Shin, DoSung Chun, Sangho Lee, SeonGoo Lee | 2002-05-28 |
| 6340846 | Making semiconductor packages with stacked dies and reinforced wire bonds | Anthony James LoBianco, Frank J. Juskey, Stephen G. Shermer, Thomas P. Glenn | 2002-01-22 |