Issued Patents 2002
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6492699 | Image sensor package having sealed cavity over active area | Thomas P. Glenn | 2002-12-10 |
| 6486545 | Pre-drilled ball grid array package | Thomas P. Glenn, Roy Dale Hollaway | 2002-11-26 |
| 6483101 | Molded image sensor package having lens holder | — | 2002-11-19 |
| 6483030 | Snap lid image sensor package | Thomas P. Glenn | 2002-11-19 |
| 6455774 | Molded image sensor package | — | 2002-09-24 |
| 6455927 | Micromirror device package | Thomas P. Glenn, Roy Dale Hollaway | 2002-09-24 |
| 6448506 | Semiconductor package and circuit board for making the package | Thomas P. Glenn, Roy D. Holloway | 2002-09-10 |
| 6441503 | Bond wire pressure sensor die package | — | 2002-08-27 |
| 6441504 | Precision aligned and marked structure | Thomas P. Glenn, Gary L. Swiss | 2002-08-27 |
| 6432737 | Method for forming a flip chip pressure sensor die package | — | 2002-08-13 |
| 6429513 | Active heat sink for cooling a semiconductor chip | Charles A. Shermer, IV, Thomas P. Glenn, Donald C. Foster | 2002-08-06 |
| 6424315 | Semiconductor chip having a radio-frequency identification transceiver | Thomas P. Glenn | 2002-07-23 |
| 6420776 | Structure including electronic components singulated using laser cutting | Thomas P. Glenn, Roy Dale Hollaway | 2002-07-16 |
| 6420201 | Method for forming a bond wire pressure sensor die package | — | 2002-07-16 |
| 6406934 | Wafer level production of chip size semiconductor packages | Thomas P. Glenn, Vincent DiCaprio | 2002-06-18 |
| 6407381 | Wafer scale image sensor package | Thomas P. Glenn, Tony Arellano | 2002-06-18 |
| 6399418 | Method for forming a reduced thickness packaged electronic device | Thomas P. Glenn, Roy Dale Hollaway | 2002-06-04 |
| 6399463 | Method of singulation using laser cutting | Thomas P. Glenn, Roy Dale Hollaway | 2002-06-04 |
| 6396043 | Thin image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2002-05-28 |
| 6389687 | Method of fabricating image sensor packages in an array | Thomas P. Glenn | 2002-05-21 |
| 6342406 | Flip chip on glass image sensor package fabrication method | Thomas P. Glenn, Roy Dale Hollaway | 2002-01-29 |