Issued Patents 2002
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494361 | Semiconductor module package substrate fabrication method | Jon Aday | 2002-12-17 |
| 6445075 | Semiconductor module package substrate | Jon Aday | 2002-09-03 |
| 6356453 | Electronic package having flip chip integrated circuit and passive chip component | Frank J. Juskey, Pat O'Brien | 2002-03-12 |