Issued Patents 2002
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6494361 | Semiconductor module package substrate fabrication method | Christopher M. Scanlan | 2002-12-17 |
| 6445075 | Semiconductor module package substrate | Christopher M. Scanlan | 2002-09-03 |