HK

Hiroyuki Kohno

KT Kabushiki Kaisha Toshiba: 1 patents #624 of 2,065Top 35%
Ricoh Company: 1 patents #186 of 609Top 35%
TO Tokuyama: 1 patents #7 of 42Top 20%
📍 Kasai, JP: #102 of 660 inventorsTop 20%
Overall (2002): #62,605 of 266,432Top 25%
2
Patents 2002

Issued Patents 2002

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
6482337 Method for evaluation of abrasion of a forming mold Shigenobu Fukui, Mikio Nishijima, Hiroyuki Suzuki 2002-11-19
6354913 Abrasive and method for polishing semiconductor substrate Naoto Miyashita, Yoshihiro Minami, Kenji Doi, Jun Takayasu, Hiroshi Kato +1 more 2002-03-12