Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffery Toh, Patrick Guay, Choong L. Wah | 2002-11-26 |
TT
Tim Teoh
Overall (2002): #101,502 of 266,432Top 40%
1
Patents 2002