Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffery Toh, Tim Teoh, Choong L. Wah | 2002-11-26 |
PG
Patrick Guay
Overall (2002): #142,542 of 266,432Top 55%
1
Patents 2002