Issued Patents 2002
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lee Choon Kuan, Jeffery Toh, Tim Teoh, Patrick Guay, Choong L. Wah | 2002-11-26 |
LC
Lim Thiam Chye
Overall (2002): #167,177 of 266,432Top 65%
1
Patents 2002