Issued Patents 2002
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6472725 | Technique for attaching die to leads | — | 2002-10-29 |
| 6429146 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2002-08-06 |
| 6410459 | Wafer planarization using a uniform layer of material and method and apparatus for forming uniform layer of material used in semiconductor processing | Guy T. Blalock, Brian F. Gordon | 2002-06-25 |
| 6380086 | High-speed planarizing apparatus for chemical-mechanical planarization of semiconductor wafers | Karl M. Robinson | 2002-04-30 |